3 thoughts on “What equipment is needed for the IC packaging test production line? Our company intends to build a small production line”
Dana
1. It depends on what product you encapsulate! 2, buy WAFER (wafer) or buy DICE (grains) yourself. DICE is thinned by others! 3, depending on whether you use a common crystal process or a replenishment process! All equipment increase or decrease! 4, the wire machine, what threads to play, the golden line and aluminum line do not need to blow nitrogen equipment, the copper wire is needed. 5, what level of plastic seal depends on. Different levels of ingredients, of course, must be used for packaging molds! The framework for packaging is also level, at least now there are copper alloys and iron alloys. 6. When the packaging is completed, it must be plated and plated tin! Electroplating plant, you can find the Foreign Association! 7. 8, testing machine, sorting machine, depends on your encapsulation form and IC category selection. 9, laser typing. 10, editing, packaging. The simplest to92 is the simplest set of 2 million!
The test will use Socket. Shenzhen Kai Zhitong is a professional production of various packaging chips (BGA, QFP, QFN, CSP, LCC ...) test seats. Test therapy manufacturer http://www.kzt.cc
1. It depends on what product you encapsulate!
2, buy WAFER (wafer) or buy DICE (grains) yourself. DICE is thinned by others!
3, depending on whether you use a common crystal process or a replenishment process! All equipment increase or decrease!
4, the wire machine, what threads to play, the golden line and aluminum line do not need to blow nitrogen equipment, the copper wire is needed.
5, what level of plastic seal depends on. Different levels of ingredients, of course, must be used for packaging molds! The framework for packaging is also level, at least now there are copper alloys and iron alloys.
6. When the packaging is completed, it must be plated and plated tin! Electroplating plant, you can find the Foreign Association!
7.
8, testing machine, sorting machine, depends on your encapsulation form and IC category selection.
9, laser typing.
10, editing, packaging.
The simplest to92 is the simplest set of 2 million!
The test will use Socket. Shenzhen Kai Zhitong is a professional production of various packaging chips (BGA, QFP, QFN, CSP, LCC ...) test seats. Test therapy manufacturer
http://www.kzt.cc
IC test packaging Taiwan is very famous, we can provide such a production line